Cleaning liquid supply device, cleaning unit, and storage medium storing program

ABSTRACT

A cleaning liquid supply device for supplying a cleaning device with cleaning liquid includes a chemical liquid inlet portion and a dilution water inlet portion, a first chemical liquid control unit fluidically connected to the chemical liquid inlet portion and the dilution water inlet portion, and a second chemical liquid control unit fluidically connected to the chemical liquid inlet portion and the dilution water inlet portion. The first chemical liquid control unit includes a first chemical-liquid-flow-rate control unit, a first dilution-water-flow-rate control unit, and a first mixing portion. The second chemical liquid control unit includes a second chemical-liquid-flow-rate control unit, a second dilution-water-flow-rate control unit, and a second mixing portion.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a divisional of U.S. patent application Ser. No.16/470,096, filed Jun. 14, 2019, which is a U.S. National Stage Entry ofPCT/JP2017/044843, filed Dec. 14, 2017; which claims priority to JPApplication No. 2017-236998 filed Dec. 11, 2017; and JP Application No.2016-244469 filed Dec. 16, 2016; the contents of each of which areincorporated herein by reference in their entirety.

TECHNICAL FIELD

The present invention relates to a cleaning liquid supply device, acleaning unit, and a storage medium storing a program.

BACKGROUND ART

A Chemical Mechanical Polishing (CMP) device includes a polishing unitfor polishing a surface of a semiconductor substrate on which asemiconductor chip is formed and a cleaning unit for cleaning thesemiconductor substrate polished at the polishing unit while supplyingthe semiconductor substrate with chemical liquid. This cleaning unitmixes the chemical liquid with a dilution water such as a De-IonizedWater (DIW) to make chemical liquid whose concentration is adjusted,thus cleaning the semiconductor substrate using the chemical liquid.

Patent Literature 1 discloses a cleaning liquid supply device of asubstrate processing device. This cleaning liquid supply device includesa processing tank 2 that accumulates a process liquid to process asubstrate and a cleaning liquid tank 3 that stores cleaning liquid to besupplied to the processing tank 2. The adjustment of a flow rate of thecleaning chemical liquid when supplying such liquid to the substrate canbe implemented by disposing a resistance portion 6 as a throttle on themiddle of a pipe 4 from the cleaning liquid tank 3 to the processingtank 2.

Patent Literature 2 discloses a cleaning device that performs scrubcleaning on a surface of a substrate with a roll cleaning member. Inthis cleaning device, cleaning liquid and a De-Ionized Water (DIW)supplied with different flow passages are supplied to a substratesurface from different nozzles.

Patent Literature 3 discloses a cleaning unit that includes a cleaningdevice and a cleaning liquid supply device. In this cleaning unit, a DIWCLC 111 and a chemical liquid CLC 113 adjust respective flow rates of aDIW and cleaning liquid, a mixer 115 mixes the DIW with the chemicalliquid after the adjustment, and then, the mixer 115 supplies an uppersurface cleaning portion 222 and a lower surface cleaning portion 223 ofa cleaning device 200 with the chemical liquid after dilution.

Patent Literature 4 discloses a cleaning unit that includes a cleaningdevice and a cleaning liquid supply device. In this cleaning unit, whenfirst chemical liquid are supplied to a cleaning device 200, a DIW CLC110 and a chemical liquid CLC 120 adjust respective flow rates of a DIWand chemical liquid, a mixer 72 mixes the DIW with the chemical liquidafter the adjustment, and then, the chemical liquid after dilution aresupplied to the cleaning device 200. Meanwhile, when second chemicalliquid are supplied to the cleaning device 200, the DIW CLC 110 and achemical liquid CLC 130 adjust respective flow rates of the DIW and thechemical liquid, a mixer 73 mixes the DIW with the chemical liquid afterthe adjustment, and then, the chemical liquid after dilution aresupplied to the cleaning device 200.

CITATION LIST—PATENT LITERATURE

Patent Literature 1: Japanese Patent Application Publication No.9-260332

Patent Literature 2: Japanese Patent Application Publication No.2014-132641

Patent Literature 3: Japanese Patent Application Publication No.2016-9818

Patent Literature 4: Japanese Patent Application Publication No.2016-15469

SUMMARY OF INVENTION

In the configurations described in Patent Literatures 1 to 4, flow ratesand concentrations of chemical liquid supplied to respective surfaces(for example, an upper surface and a lower surface) of a substratecannot be independently controlled.

When the chemical liquid are supplied to only any one of the respectivesurfaces of the substrate with the conventional configuration ofcleaning liquid supply device exemplified in Patent Literature 1-4, itis necessary to dispose open/close valves on the respective flowpassages in a cleaning device to control flow and cutoff of the chemicalliquid through each flow passage.

Recently, an alternative configuration of cleaning liquid supply devicein which the chemical liquid and/or the DIW are supplied from a commonsupply source to a plurality of processing devices of semiconductorsubstrate in a plant has been studied. In the cleaning liquid supplydevice having such configuration, there is a possibility of lack of apressure of the chemical liquid and/or the DIW to be supplied to acleaning liquid supply device, depending on an installation site of thedevice. Thus, when the supply pressure of the chemical liquid and/or theDIW to the cleaning liquid supply device is low, the cleaning liquidsupply device and the cleaning device, which have a pressure loss intheir flow passages and their conventional configurations, possiblycannot supply the substrate with the chemical liquid having a sufficientflow rate.

For example, in the conventional cleaning unit, when the chemical liquidand/or the DIW are supplied to the respective surfaces of the substrate,the respective flow passages are branched from the common flow passageto sides of the respective surfaces of the substrate, and the throttleis disposed on one flow passage to adjust the flow rate. When the supplypressure of the chemical liquid and/or the DIW to the cleaning liquidsupply device is low, the pressure loss at a throttle part possiblycannot supply the substrate with the chemical liquid having thesufficient flow rate.

An object of the present invention is to solve at least a part of theabove-described problems.

According to one aspect of the present invention, a device for supplyinga cleaning device with chemical liquid for cleaning is provided. Thedevice includes a chemical liquid inlet portion and a dilution waterinlet portion, a first chemical liquid control unit fluidicallyconnected to the chemical liquid inlet portion and the dilution waterinlet portion, and a second chemical liquid control unit fluidicallyconnected to the chemical liquid inlet portion and the dilution waterinlet portion. The first chemical liquid control unit includes a firstchemical-liquid-flow-rate control unit configured to receive a supply ofchemical liquid from the chemical liquid inlet portion to control a flowrate of the chemical liquid, a first dilution-water-flow-rate controlunit configured to receive a supply of a dilution water from thedilution water inlet portion to control a flow rate of the dilutionwater, and a first mixing portion that mixes the chemical liquid and thedilution water from the first chemical-liquid-flow-rate control unit andthe first dilution-water-flow-rate control unit. The secondchemical-liquid control unit includes a second chemical-liquid-flow-ratecontrol unit configured to receive a supply of the chemical liquid fromthe chemical liquid inlet portion to control a flow rate of the chemicalliquid, a second dilution-water-flow-rate control unit configured toreceive a supply of the dilution water from the dilution water inletportion to control a flow rate of the dilution water, and a secondmixing portion configured to mix the chemical liquid and the dilutionwater from the second chemical-liquid-flow-rate control unit and thesecond dilution-water-flow-rate control unit.

According to one aspect of the present invention, a device for supplyinga cleaning device with chemical liquid for cleaning is provided. Thedevice includes a flowmeter, a first pipe that enters into theflowmeter, and a second pipe that exits from the flowmeter. The firstpipe and the second pipe are inclined from a horizontal direction and avertical direction.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1 is a schematic front view illustrating a cleaning liquid supplydevice according to one embodiment.

FIG. 2 is a fluid circuit diagram of a cleaning unit according to theone embodiment.

FIG. 3 is a block diagram illustrating a configuration of a flow ratecontrol valve unit (CLC) according to the one embodiment.

FIG. 4 is an exemplary flowchart of a chemical liquid supply process.

FIG. 5 is a plan view illustrating an overall configuration of apolishing device including the cleaning unit according to the oneembodiment.

FIG. 6A is an explanatory view describing a mounting structure of theCLC.

FIG. 6B is an explanatory view describing a mounting structure of theCLC.

FIG. 6C is an explanatory view describing a mounting structure of theCLC.

FIG. 7 is a plan view of the CLC.

FIG. 8 is a side view of the CLC.

FIG. 9 is a plan view of a CLC assembly.

FIG. 10A is a side view from one side of the CLC assembly.

FIG. 10B is a side view from another side of the CLC assembly.

FIG. 11 is a side view of the mounting structure of the CLC.

FIG. 12 is a perspective view of the mounting structure of the CLC.

FIG. 13 is a flowchart of a flow rate control according to anotherexample.

FIG. 14 is a flowchart of an abnormality detection control using apressure gauge.

DESCRIPTION OF EMBODIMENTS

The following describes one embodiment of the present invention withreference to the drawings. FIG. 1 is a schematic front view illustratinga cleaning liquid supply device according to the one embodiment of thepresent invention. A cleaning liquid supply device 100 in thisembodiment is configured to supply a cleaning device 200 included in asubstrate processing device with chemical liquid (for example,hydrofluoric acid and ammonia solution) for cleaning. The substrateprocessing device includes, for example, a polishing device such as aChemical Mechanical Polishing (CMP) device.

As illustrated in FIG. 1, the cleaning liquid supply device 100according to the one embodiment includes a case 101, a first chemicalliquid dilution box (a first chemical liquid control unit) 120, a secondchemical liquid dilution box (a second chemical liquid control unit)130, and a plurality of chemical liquid utility boxes 50. The firstchemical liquid dilution box 120, the second chemical liquid dilutionbox 130, and the plurality of chemical liquid utility boxes 50 arehoused in the case 101. The first chemical liquid dilution box 120 andthe second chemical liquid dilution box 130 mix chemical liquid with adilution water to generate chemical liquid (chemical liquid afterdilution) whose flow rate and concentration are adjusted. The dilutionwater is any dilution medium including a De-Ionized Water (DIW). In thefollowing description, the dilution water is described as the DIW, butthe dilution water may be a dilution medium other than the DIW. In thecleaning liquid supply device 100, the chemical liquid utility box 50has a configuration to introduce the chemical liquid from a chemicalliquid supply source 20 to the cleaning liquid supply device 100. In theexample illustrated in the drawing, six chemical liquid utility boxes 50are disposed in the cleaning liquid supply device 100, but this is oneexample. The number of chemical liquid utility boxes 50 is changed asnecessary corresponding to a specification of the cleaning device 200.

FIG. 2 is a fluid circuit diagram of a cleaning unit according to theone embodiment. A cleaning unit 10 includes the cleaning liquid supplydevice 100 and the cleaning device 200. In the cleaning liquid supplydevice 100, the chemical liquid utility box 50 includes an input portion51 connected to the chemical liquid supply source 20 (see FIG. 2), anopen/close valve 52, a lockout valve 53, and a pressure gauge 54. Anopen/close control is performed on the open/close valve 52 by a signalfrom a control device 110. The lockout valve 53, which is a valvemanually opened and closed, is used, for example, when the chemicalliquid supply source 20 is separated from the cleaning liquid supplydevice 100 in maintenance. The pressure gauge 54 detects a pressure ofthe chemical liquid introduced from the chemical liquid supply source 20to the cleaning liquid supply device 100. In this example, the inputportion 51 constitutes a chemical liquid inlet portion. When thechemical liquid utility box 50 is omitted, a connecting portion of thecleaning liquid supply device 100 to the chemical liquid supply source20 constitutes the chemical liquid inlet portion.

The control device 110, for example, may be a control device disposed onthe cleaning liquid supply device 100, may be a control device disposedon the cleaning unit 10, or may be a control device disposed on thesubstrate processing device such as the polishing device on which thecleaning unit 10 is disposed. The control device 110 includes a computeror a control circuit such as a microcomputer and a sequencer, and astoring medium (for example, a volatile or non-volatile memory) thatstores a program executed in the control circuit. The program includes aprogram to perform a supply of the chemical liquid (the chemical liquidafter dilution) and cleaning by the cleaning liquid supply device 100and the cleaning device 200. Respective units of the cleaning liquidsupply device 100 and the cleaning device 200 are controlled inaccordance with this program. The above-described program may be storedin a storing medium (for example, a CD and a flash memory) attachableto/detachable from the control device 110. The above-described programmay be stored in a storing medium readable by the control device 110 bywire or air.

The cleaning liquid supply device 100 further includes a regulator 60 tointroduce the DIW from a DIW supply source 30 to the cleaning liquidsupply device 100. The regulator 60 adjusts a pressure of the DIW fromthe DIW supply source 30 to output it to the first chemical liquiddilution box 120 and the second chemical liquid dilution box 130 viapipes 90, 91, and 92. In this example, an input portion 61 of theregulator 60 constitutes a dilution water inlet portion. When theregulator 60 is omitted, a connecting portion of the cleaning liquidsupply device 100 to the DIW supply source 30 constitutes the dilutionwater inlet portion.

The first chemical liquid dilution box 120 controls respective flowrates of the chemical liquid and the DIW to output the chemical liquid(the chemical liquid after dilution) having desired flow rate andconcentration. The first chemical liquid dilution box 120 includes aninput portion connected to the chemical liquid utility box 50 via pipes80 and 81 and connected to the regulator 60 via the pipes 90 and 91. Thefirst chemical liquid dilution box 120 includes an output portionconnected to a nozzle 211 of a cleaning portion 210 in the cleaningdevice 200 via a pipe 85.

The first chemical liquid dilution box 120 includes a first chemicalliquid CLC (a first chemical liquid-flow-rate control unit) 121, a firstDIW CLC (a first dilution-water-flow-rate control unit) 122, and amixing portion 123. A Closed Loop Controller (CLC) is a flow ratecontrol valve unit formed of a closed-loop control device as illustratedin FIG. 3, and its details will be described below. The first chemicalliquid CLC 121 controls the flow rate of the chemical liquid from thechemical liquid utility box 50 to output them. The first DIW CLC 122controls the flow rate of the DIW from the regulator 60 to output it.The first chemical liquid CLC 121 includes an output portion connectedto a pipe 83. The first DIW CLC 122 includes an output portion connectedto a pipe 93. The pipe 83 and the pipe 93 join together to the pipe 85.The pipe 83, the pipe 93, and the pipe 85 have a join point thatconstitutes the mixing portion 123. The mixing portion 123 mixes thechemical liquid whose flow rate is controlled in the first chemicalliquid CLC 121 with the DIW whose flow rate is controlled in the firstDIW CLC 122 to output the chemical liquid (the chemical liquid afterdilution) having the desired flow rate and concentration. The flow rateand the concentration of the chemical liquid after dilution aredetermined corresponding to the flow rates of the chemical liquid andthe DIW set in the first chemical liquid CLC 121 and the first DIW CLC122 by the signal from the control device 110.

FIG. 3 is a block diagram illustrating a configuration of the flow ratecontrol valve unit (CLC) according to the one embodiment. The firstchemical liquid CLC 121 and the first DIW CLC 122 include a flowmeter1212, a flow rate control valve (an internal control valve) 1211, and acontrol unit 1213 as illustrated in FIG. 3. The flowmeter 1212 of thefirst chemical liquid CLC 121 is an ultrasonic flowmeter. From an aspectof reduction in pressure loss, the ultrasonic flowmeter is preferablyused as the flowmeter 1212. However, considering the pressure loss inthe whole of the cleaning liquid supply device 100 and the cleaningdevice 200, a differential pressure flowmeter (an orifice flowmeter) maybe used. As the flowmeter 1212 of the first DIW CLC 122, a differentialpressure flowmeter (an orifice flowmeter) is used. As the flowmeter 1212of the first DIW CLC 122, an ultrasonic flowmeter may be employed. Theflow rate control valve 1211 is a motor valve in this embodiment. Adegree of opening of a valve body 1211 a is controlled by power of adriving source 1211 b including a motor. The flow rate control valve1211 may be a valve whose degree of opening is adjustable; that is theflow rate control valve 1211 may be another type of variable flow ratevalve (for example, a solenoid valve driven by a solenoid or the like).The control unit 1213 includes a control circuit such as amicrocomputer, and a memory that stores a program executed in thecontrol circuit. The control circuit and the memory are implemented in,for example, a control substrate. The control unit 1213 receives a flowrate set value iT of a fluid from the control device 110 and receives aflow rate detected value io of a fluid from the flowmeter 1212 toperform feedback control on the flow rate control valve 1211 such thatthe flow rate detected value io matches up with the flow rate set valueiT. In the first chemical liquid CLC 121, the fluid is the chemicalliquid. In the first DIW CLC 122, the fluid is the DIW.

Here, the flow rate control valve unit (CLC) including the flowmeter,the flow rate control valve, and the control unit is exemplified, but apart or all of them may be disposed as separate bodies. For example, theflowmeter 1212 and the flow rate control valve 1211 may be disposed asthe separate bodies, and instead of the control unit 1213 (or via thecontrol unit 1213), the control device 110 may control the flow ratecontrol valve 1211 based on a detected value from the flowmeter 1212 tocontrol the flow rate. The control device 110 may control the flow ratecontrol valve 1211 via another driving circuit as necessary.

The first chemical liquid dilution box 120 further includes a suck backvalve unit 141 and a pressure gauge 142 as illustrated in FIG. 2. Thesuck back valve unit 141 is an open/close valve having a drippingprevention function. The suck back valve unit 141 is a valve unitincluding a suck back valve, which suctions the fluid on a downstreamside with a function that generates a volume change by deformation of adiaphragm, and an open/close valve (a stop valve, a two-way valve),which opens and closes the flow passage. The suck back valve unit 141ensures reduction or prevention of dripping from the nozzle 211 (seeFIG. 2) when the output of the chemical liquid (the chemical liquidafter dilution) from the first chemical liquid dilution box 120 is cutoff. The pressure gauge 142, which is one that detects a pressure of thechemical liquid (the chemical liquid after dilution) output by themixing portion 123, detects the pressure of the chemical liquid (thechemical liquid after dilution) in the pipe 85 where the pipe 83 and thepipe 93 join together.

The second chemical liquid dilution box 130 controls the respective flowrates of the chemical liquid and the DIW to output the chemical liquid(the chemical liquid after dilution) having the desired flow rate andconcentration. The second chemical liquid dilution box 130 controls therespective flow rates of the chemical liquid and the DIW independentlyfrom the control of the first chemical liquid dilution box 120. Thesecond chemical liquid dilution box 130 includes an input portionconnected to the chemical liquid utility box 50 via the pipe 80 and apipe 82 and connected to the regulator 60 via the pipe 90 and the pipe92. The second chemical liquid dilution box 130 includes an outputportion connected to a nozzle 212 of the cleaning portion 210 in thecleaning device 200 via a pipe 95 and connected to a nozzle (notillustrated) of a waiting portion 230 in the cleaning device 200 via apipe 96.

The second chemical liquid dilution box 130 includes a second chemicalliquid CLC (a second chemical-liquid-flow-rate control unit) 131, asecond DIW CLC (a second dilution-water-flow-rate control unit) 132, anda mixing portion 133. The second chemical liquid CLC 131 controls a flowrate of the chemical liquid from the chemical liquid utility box 50 tooutput them. The second DIW CLC 132 controls a flow rate of the DIW fromthe regulator 60 to output it. The second chemical liquid CLC 131includes an output portion connected to a pipe 84. The second DIW CLC132 includes an output portion connected to a pipe 94. The pipe 84 andthe pipe 94 join together to the pipe 86. The pipe 84, the pipe 94, andthe pipe 86 have a join point that constitutes the mixing portion 133.The mixing portion 133 mixes the chemical liquid whose flow rate iscontrolled in the second chemical liquid CLC 131 with the DIW whose flowrate is controlled in the second DIW CLC 132 to output the chemicalliquid (the chemical liquid after dilution) having the desired flow rateand concentration. The flow rate and the concentration of the chemicalliquid after dilution are determined corresponding to the flow rates ofthe chemical liquid and the DIW set in the second chemical liquid CLC131 and the second DIW CLC 132 by the signal from the control device110.

The second chemical liquid CLC 131 and the second DIW CLC 132 have theconfiguration illustrated in FIG. 3 similarly to the first chemicalliquid CLC 121 and the first DIW CLC 122. The flowmeter 1212 of thesecond chemical liquid CLC 131 is an ultrasonic flowmeter similarly tothe first chemical liquid CLC 121. From the aspect of the reduction inthe pressure loss, the ultrasonic flowmeter is preferably used as theflowmeter 1212. However, considering the pressure loss in the whole ofthe cleaning liquid supply device 100 and the cleaning device 200, adifferential pressure flowmeter (an orifice flowmeter) may be used. Asthe flowmeter 1212 of the second DIW CLC 132, a differential pressureflowmeter (an orifice flowmeter) is used similarly to the first DIW CLC122. As the flowmeter 1212 of the second DIW CLC 132, an ultrasonicflowmeter may be employed. In the second chemical liquid CLC 131, thefluid is the chemical liquid. In the second DIW CLC 132, the fluid isthe DIW. Other configurations are as described above. Thus, theirdescription is omitted.

The second chemical liquid dilution box 130 further includes anopen/close valve 151, an open/close valve 152, and a pressure gauge 153as illustrated in FIG. 2. The open/close valve 151 is disposed on thepipe 95 branched from the pipe 86. The open/close valve 151 releases andcuts off a fluid connection between the mixing portion 133 and thenozzle 212 on a side of a substrate lower surface in the cleaning device200. The open/close valve 152 is disposed on the pipe 96 branched fromthe pipe 86. The open/close valve 152 releases and cuts off a fluidconnection between the mixing portion 133 and the waiting portion 230 inthe cleaning device 200. The pressure gauge 153, which is one thatdetects a pressure of the chemical liquid (the chemical liquid afterdilution) output by the mixing portion 133, detects the pressure of thechemical liquid in the pipe 86 where the pipe 84 and the pipe 94 jointogether.

The cleaning device 200, which is installed on the substrate processingdevice such as the polishing device, is a device that cleans a substrateW. The cleaning device 200, which is connected to the cleaning liquidsupply device 100 via the pipes 85, 95, and 96 as illustrated in FIG. 2,receives the supply of the chemical liquid (the chemical liquid afterdilution) and/or the DIW from the cleaning liquid supply device 100. Thecleaning device 200 includes the cleaning portion 210 and the waitingportion 230. The cleaning portion 210 supplies a first surface and asecond surface (in this example, an upper surface and a lower surface)of the substrate W with the chemical liquid (the chemical liquid afterdilution) to clean the substrate W with the chemical liquid. A substratewaiting the cleaning in the cleaning portion 210 is arranged on thewaiting portion 230. When the cleaning device 200 includes a DIWcleaning portion where the cleaning is performed with the DIW, a pipe tosupply the DIW may be disposed on the cleaning liquid supply device 100.Any of the first surface and the second surface of the substrate W maybe an upper surface the lower surface of the substrate W. When thesubstrate W is arranged standing in a vertical direction, the firstsurface and the second surface of the substrate W are surfaces extendingin the vertical direction.

The cleaning portion 210 includes one or a plurality of nozzles 211arranged on a side of the upper surface of the substrate W and thenozzle 212 arranged on a side of the lower surface of the substrate W.For avoiding complicated drawing, FIG. 2 illustrates only one nozzle211.

The one or plurality of nozzles 211, which are arranged on the upperside of the substrate W, inject the chemical liquid (the chemical liquidafter dilution) toward the upper surface of the substrate W. The nozzle211, which is connected to the output of the first chemical liquiddilution box 120 in the cleaning liquid supply device 100 via the pipe85, receives the supply of the chemical liquid (the chemical liquidafter dilution) adjusted to have the desired flow rate and concentrationin the first chemical liquid dilution box 120. As a part or all of thenozzles 211, low-pressure-loss-type nozzles (for example, one having aflat type injection port) are preferably used to reduce the pressureloss in the flow passage.

The nozzle 212 has a configuration where a plurality of nozzle holes areprovided on a common chassis. The nozzle 212, which is arranged on thelower side of the substrate W, injects the chemical liquid (the chemicalliquid after dilution) toward the lower surface of the substrate W. Thenozzle 212, which is connected to the output of the second chemicalliquid dilution box 130 in the cleaning liquid supply device 100 via thepipe 95, receives the supply of the chemical liquid (the chemical liquidafter dilution) adjusted to have the desired flow rate and concentrationin the second chemical liquid dilution box 130. As the nozzle 212, alow-pressure-loss-type nozzle is preferably used to reduce the pressureloss in the flow passage.

The waiting portion 230 receives the supply of the chemical liquid (thechemical liquid after dilution) adjusted to have the desired flow rateand concentration in the second chemical liquid dilution box 130. Theopen/close valves 151 and 152 may be controlled to supply only any oneof the nozzle 212 of the cleaning portion 210 or the waiting portion 230with the chemical liquid (the chemical liquid after dilution) from thesecond chemical liquid dilution box 130.

From the aspect to reduce the pressure loss in the flow passage, as thepipes from the supply sources 20 and 30 to the nozzles 211 and 212 andthe waiting portion 230, ones having a large inner diameter and a smallpressure loss are preferably used. As the valves (52, 151, 152, and 141)as well, ones having a small pressure loss are preferably used.

(Chemical Liquid Supply Process)

The following describes a chemical liquid or cleaning liquid supplyprocess in the cleaning liquid supply device 100 illustrated in FIG. 2.Usually, the lockout valve 53 has been released. The open/close valve 52of the chemical liquid utility box 50 is released by the signal from thecontrol device 110 at the start of the chemical liquid supply process.The regulator 60 is operated by the signal from the control device 110.The suck back valve unit 141, the open/close valve 151, and theopen/close valve 152 are released by the signal from the control device110. The chemical liquid utility box 50 and the regulator 60 supply thefirst chemical liquid dilution box 120 and the second chemical liquiddilution box 130 with the chemical liquid and the DIW. The open/closevalve 52, the regulator 60, the suck back valve unit 141, and theopen/close valves 151 and 152 are controlled by the signal from thecontrol device 110. The control device 110 controls the first chemicalliquid CLC 121 and the first DIW CLC 122 in accordance with the programstored in the storing medium.

In the first chemical liquid dilution box 120, the first chemical liquidCLC 121 controls the flow rate of the chemical liquid to have a flowrate set value from the control device 110, the first DIW CLC 122controls the flow rate of the DIW to have a flow rate set value from thecontrol device 110, and the mixing portion 123 mixes the chemical liquidwith the DIW after the flow rate adjustment to generate the chemicalliquid (the chemical liquid after dilution) controlled to havepredetermined flow rate and concentration, thus outputting them to thenozzle 211 on a side of the substrate upper surface in the cleaningdevice 200. The first chemical liquid CLC 121 and the first DIW CLC 122are controlled by the signal from the control device 110. The controldevice 110 controls the first chemical liquid CLC 121 and the first DIWCLC 122 in accordance with the program stored in the storing medium.

In the second chemical liquid dilution box 130, the second chemicalliquid CLC 131 controls the flow rate of the chemical liquid to have aflow rate set value from the control device 110, the second DIW CLC 132controls the flow rate of the DIW to have a flow rate set value from thecontrol device 110, and the mixing portion 133 mixes the chemical liquidwith the DIW after the flow rate adjustment to generate the chemicalliquid (the chemical liquid after dilution) controlled to havepredetermined flow rate and concentration, thus outputting them to thenozzle 212 on the substrate lower surface side in the cleaning device200. The mixing portion 133 supplies the waiting portion 230 in thecleaning device 200 with the chemical liquid (the chemical liquid afterdilution) controlled to have the predetermined flow rate andconcentration. The second chemical liquid CLC 131 and the second DIW CLC132 are controlled by the signal from the control device 110. Thecontrol device 110 controls the second chemical liquid CLC 131 and thesecond DIW CLC 132 in accordance with the program stored in the storingmedium.

When one of the supply of the chemical liquid (the chemical liquid afterdilution) to the nozzle 211 and the nozzle 212 is stopped, one of thesuck back valve unit 141 or the open/close valve 151 is closed and oneis opened (the flow rate control valves of the first chemical liquid CLC121 and the first DIW CLC 122 or the flow rate control valves of thesecond chemical liquid CLC 131 and the second DIW CLC 132 may beclosed).

When the chemical liquid (the chemical liquid after dilution) aresupplied to the nozzle 211 and the supply of the chemical liquid to thenozzle 212 and the waiting portion 230 is stopped, the open/close valve141 is opened and the open/close valves 151 and 152 are closed (the flowrate control valves of the second chemical liquid CLC 131 and the secondDIW CLC 132 may be closed).

When one of the supply of the chemical liquid (the chemical liquid afterdilution) to the nozzle 212 or the waiting portion 230 is stopped, oneof the open/close valve 151 or the open/close valve 152 is closed.

In the cleaning portion 210 of the cleaning device 200, the respectivechemical liquid (chemical liquid after dilution) whose flow rates andconcentrations are controlled independently in the first chemical liquiddilution box 120 and the second chemical liquid dilution box 130 aresupplied to the upper surface and the lower surface of the substrate Wfrom the nozzle 211 and the nozzle 212 to clean the substrate W. Forexample, the chemical liquid having a concentration lower than aconcentration of the chemical liquid to the nozzle 212 can be suppliedto the nozzle 211. The cleaning device 200 is controlled by the signalfrom the control device 110. The control device 110 controls thecleaning device 200 in accordance with the program stored in the storingmedium.

(Flowchart)

FIG. 4 is an exemplary flowchart of the chemical liquid supply process.These processes are executed in the control device 110.

In Step S11, it is determined whether the open/close valve 52 isreleased or not. When it is determined that the open/close valve 52 isreleased in Step S11, the open/close valve 52 is released by the signalfrom the control device 110 in Step S12.

In Step S13, it is determined whether the suck back valve unit 141 isreleased or not. When it is determined that the suck back valve unit 141is released in Step S13, the suck back valve unit 141 is released by thesignal from the control device 110 in Step S14. When the suck back valveunit 141 has already been released, the state where the suck back valveunit 141 has been released is maintained. Meanwhile, when it isdetermined that the state where the suck back valve unit 141 has beenclosed is maintained or the suck back valve unit 141 is closed, the suckback valve unit 141 is controlled by the control device 110 so that thestate where the suck back valve unit 141 has been closed is maintainedor the suck back valve unit 141 is closed.

In Step S15, in the first chemical liquid dilution box 120, the firstchemical liquid CLC 121 controls the flow rate of the chemical liquid tohave the flow rate set value from the control device 110, and the firstDIW CLC 122 controls the flow rate of the DIW to have the flow rate setvalue from the control device 110.

In Step S16, the mixing portion 123 mixes the chemical liquid with theDIW after the flow rate adjustment to generate the chemical liquid (thechemical liquid after dilution) controlled to have the predeterminedflow rate and concentration, thus outputting them to the nozzle 211 onthe substrate upper surface side in the cleaning device 200. When thevalve 141 has been closed, the chemical liquid (the chemical liquidafter dilution) are not output to the nozzle 211 on the substrate uppersurface side in the cleaning device 200. In this case, the operation ofthe first chemical liquid CLC 121 and the first DIW CLC 122 may bestopped.

In Step S17, it is determined whether the open/close valve 151 isreleased or not. When it is determined that the open/close valve 151 isreleased in Step S17, the open/close valve 151 is released by the signalfrom the control device 110 in Step S18. When the open/close valve 151has already been released, the state where the open/close valve 151 hasbeen released is maintained. Meanwhile, when it is determined that thestate where the open/close valve 151 has been closed is maintained orthe open/close valve 151 is closed, the open/close valve 151 iscontrolled by the control device 110 so that the state where theopen/close valve 151 has been closed is maintained or the open/closevalve 151 is closed.

In Step S19, it is determined whether the open/close valve 152 isreleased or not. When it is determined that the open/close valve 152 isreleased in Step S19, the open/close valve 152 is released by the signalfrom the control device 110 in Step S20. When the open/close valve 152has already been released, the state where the open/close valve 152 hasbeen released is maintained. Meanwhile, when it is determined that thestate where the open/close valve 152 has been closed is maintained orthe open/close valve 152 is closed, the open/close valve 152 iscontrolled by the control device 110 so that the state where theopen/close valve 152 has been closed is maintained or the open/closevalve 152 is closed.

In Step S21, in the second chemical liquid dilution box 130, the secondchemical liquid CLC 131 controls the flow rate of the chemical liquid tohave the flow rate set value from the control device 110, and the secondDIW CLC 132 controls the flow rate of the DIW to have the flow rate setvalue from the control device 110.

In Step S22, the mixing portion 133 mixes the chemical liquid with theDIW after the flow rate adjustment to generate the chemical liquid (thechemical liquid after dilution) controlled to have the predeterminedflow rate and concentration, thus outputting them to the nozzle 212 onthe substrate lower surface side and outputting them to the waitingportion 230 in the cleaning device 200.

When the open/close valve 151 has been closed, the chemical liquid (thechemical liquid after dilution) are not output to the nozzle 212 on thesubstrate lower surface side in the cleaning device 200. When theopen/close valve 152 has been closed, the chemical liquid (the chemicalliquid after dilution) are not supplied to the waiting portion 230. Whenboth of the open/close valves 151 and 152 have been closed, the chemicalliquid (the chemical liquid after dilution) are not supplied to thenozzle 212 and the waiting portion 230. When both of the open/closevalves 151 and 152 have been closed, the operation of the secondchemical liquid CLC 131 and the second DIW CLC 132 may be stopped.

In Step S23, it is determined whether there is an end instruction of thechemical liquid supply process or not. When there is the endinstruction, after an end process such as closing the released valve andstopping the regulator and the CLC is executed in Step S24, the chemicalliquid supply process is ended. Meanwhile, there is no end instruction,returning to Step S13, the processes in Steps S13 to S16 and Steps S17to S22 are repeated.

With this chemical liquid supply process, the first chemical liquiddilution box 120 and the second chemical liquid dilution box 130 eachare allowed to control the flow rate and the concentration of thechemical liquid independently (S13 to S16, S17 to S22). The supply ofthe chemical liquid (the chemical liquid after dilution) from one of thefirst chemical liquid dilution box 120 or the second chemical liquiddilution box 130 can be stopped (S13 and S14, S17 to S20).

(Exemplary Substrate Processing Device)

The following describes an exemplary configuration of the polishingdevice as one example of the substrate processing device including thecleaning unit according to the above-described one embodiment. FIG. 5 isa plan view illustrating an overall configuration of the polishingdevice including the cleaning unit according to the one embodiment.

As illustrated in FIG. 5, a polishing device 1 includes a housing 2 inan about rectangular shape and a load port 3 on which a substratecassette, which stocks a plurality of substrates such as semiconductorwafers, is placed. An open cassette, a Standard Manufacturing Interface(SMIF) pod, or a Front Opening Unified Pod (FOUP) can be mounted on theload port 3. The housing 2 internally houses a plurality of (in thisexample, four) polishing units 4 a to 4 d, cleaning units 5 a and 5 b,which clean the substrate after polishing, and a drying unit 6, whichdries the substrate after cleaning. The cleaning unit 10 according tothe embodiment of the present invention is applied to at least one ofthe cleaning units 5 a and 5 b.

A first transport robot 7 is arranged in a region surrounded by the loadport 3, the polishing unit 4 a, and the drying unit 6. A transport unit8 is arranged parallel to the polishing units 4 a to 4 d. The firsttransport robot 7 receives the substrate before polishing from the loadport 3 to hand over it to the transport unit 8, and receives thesubstrate after drying from the drying unit 6 to return it to the loadport 3. The transport unit 8 transports or conveys the substratereceived from the first transport robot 7 to perform delivery andreceipt of the substrate between the respective polishing units 4 a to 4d. A second transport robot 9 a is arranged positioned between thecleaning unit 5 a and the cleaning unit 5 b to perform delivery andreceipt of the substrate between the transport unit 8 and theserespective units 5 a and 5 b. A third transport robot 9 b is arrangedpositioned between the cleaning unit 5 b and the drying unit 6 toperform delivery and receipt of the substrate between these respectiveunits 5 b and 6. Further, a control device 300 is arranged positioned inthe housing 2 to control operation of each equipment of the polishingdevice 1. As the above-described control device 110, the control device300 of the polishing device may be used.

FIG. 6A to FIG. 6C are explanatory views describing mounting structuresof the CLC. In the following description, the first chemical liquid CLC121 is exemplified as the CLC, but other chemical liquid CLC and DIW CLChave similar configurations. As described above, the first chemicalliquid CLC 121 includes the flow rate control valve 1211 and theflowmeter 1212, and they are connected with a pipe 800 to be housed in achassis 1214. FIG. 6A illustrates a case where the first chemical liquidCLC 121 is mounted so that a direction of the fluid passing through theflowmeter 1212 is a horizontal direction, that is, so that piping parts803 a and 803 b are horizontal. FIG. 6B illustrates a case where thefirst chemical liquid CLC 121 is mounted so that the direction of thefluid passing through the flowmeter 1212 is the vertical direction. FIG.6C illustrates a case where the first chemical liquid CLC 121 is mountedso that the direction of the fluid passing through the flowmeter 1212 isinclined with respect to the vertical direction and the horizontaldirection. The vertical direction and the horizontal direction areassumed to indicate a vertical direction and a horizontal direction withrespect to an installation surface of a device such as the cleaningliquid supply device. Piping parts 801, 802, and 803 a may be formed byperforming bending work on one pipe, or may be formed such that a partor all of the piping parts are prepared as separate bodies and they areconnected to one another. Piping parts 803 b and 804 a may be formed byperforming bending work on one pipe, or may be formed such that a partor all of the piping parts are prepared as separate bodies and they areconnected to one another. Piping parts 804 b and 805 may be formed byperforming bending work on one pipe, or may be formed such that a partor all of the piping parts are prepared as separate bodies and they areconnected to one another. The piping parts 803 a and 803 b can beconnected as one pipe, and the flowmeter as arranged in its peripheralarea can be used. In the following description, when it is not necessaryto distinguish the piping parts 803 a and 803 b, any piping part 803 aor 803 b or a combination of the piping parts 803 a and 803 b may bereferred to as a piping part 803. The same applies to the piping parts804 a and 804 b.

As illustrated in FIG. 6A to FIG. 6C, the pipe 800 in the first chemicalliquid CLC 121 includes the piping parts 801, 803 a, 803 b, and 805extending in the horizontal direction and the piping parts 802, 804 a,and 804 b extending in the vertical direction when the chassis 1214 isarranged such that its longitudinal direction is oriented in thehorizontal direction (FIG. 6A). When the first chemical liquid CLC 121is arranged in the state in FIG. 6A, the piping parts 803 a and 803 b onan inlet side and an exit side of the flowmeter 1212 are oriented in thehorizontal direction, thus causing a state where air bubbles are likelyto remain in the fluid inside the piping parts 803 a and 803 b. Bentportions where the respective piping parts are bent are formed near aboundary between the piping part 803 a extending in the horizontaldirection and the piping part 802 extending in the vertical directionand near a boundary between the piping part 803 b extending in thehorizontal direction and the piping part 804 a extending in the verticaldirection. The air bubbles are likely to remain near such a bentportion. The air bubbles remain at these parts to cause the air bubblesto be contained also in the fluid passing through the flowmeter 1212.When the flowmeter 1212 is the ultrasonic flowmeter, a detectionaccuracy of the flow rate possibly decreases due to the air bubbles inthe fluid. Also when the flowmeter 1212 is the differential pressureflowmeter, the detection accuracy of the flow rate possibly decreases ifdrift (bias of the flow rate) is generated caused by the air bubbles inthe pipe or in the fluid. In the state in FIG. 6B, the air bubbles arelikely to remain in the piping parts 802, 804 a, and 804 b extending inthe horizontal direction, and the air bubbles are likely to remain nearthe boundary between the piping part 802 extending in the horizontaldirection and the piping part 803 a extending in the vertical direction.The air bubbles remain at these parts to possibly cause the air bubblesto be contained also in the fluid passing through the flowmeter 1212.Similarly to the case in FIG. 6A, when the flowmeter 1212 is theultrasonic flowmeter, the detection accuracy of the flow rate possiblydecreases due to the air bubbles in the fluid. Also when the flowmeter1212 is the differential pressure flowmeter, the detection accuracy ofthe flow rate possibly decreases if the drift (the bias of the flowrate) is generated caused by the air bubbles in the pipe or in thefluid.

Meanwhile, in the state in FIG. 6C, the respective piping parts of thepipe 800 are inclined with respect to the horizontal direction and thevertical direction. The flow passage in the flowmeter 1212 is alsoinclined with a gradient identical to those of the piping parts 803 aand 803 b. The piping parts 803 a and 803 b (a flow direction passingthrough the flowmeter) are preferably inclined with an angle of 10degrees or more and 40 degrees or less with respect to the verticaldirection. In this case, all of the piping part 802, the piping parts803 a and 803 b, and the piping parts 804 a and 804 b are inclined withrespect to the horizontal direction. Thus, the air bubbles are likely topass through the boundary between the piping part 802 and the pipingpart 803 a and the boundary between the piping part 803 b and the pipingpart 804 a, thus ensuring reduction in remaining of the air bubbles. Thesame applies to the piping part 801 and the piping part 802, and thesame applies to the piping part 804 b and the piping part 805.Therefore, as in FIG. 6C, mounting the first chemical liquid CLC 121such that the respective piping parts of the pipe 800 are inclined withrespect to the horizontal direction ensure reduction in air bubblesremaining in the pipe to suppress the air bubbles from being containedin the fluid passing through the flowmeter 1212. This results in animprovement in the detection accuracy of the flowmeter 1212.

In FIGS. 6A to 6C, the case where the pipe 800 has parts (the bentportions) bent into an L shape is illustrated, but the pipe 800 may haveparts bent with an angle other than the right angle. Also when the pipe800 is linear without having a bent part, mounting the first chemicalliquid CLC 121 such that the pipe 800 is inclined with respect to thehorizontal direction and the vertical direction as in FIG. 6C ensuresthe reduction in the air bubbles remaining in the pipe to suppress theair bubbles from being contained in the fluid passing through theflowmeter 1212. This results in the improvement in the detectionaccuracy of the flowmeter 1212. For example, it is a case where thepiping parts 801, 802, 803 a, 803 b, 804 a, 804 b, and 805 are extendingin a straight line in FIG. 6C.

In the mounting structure in FIG. 6A, when the piping parts 801 and 805extending in the horizontal direction (in other words, an inlet portion1214 a and an outlet portion 1214 b that open in the horizontaldirection) are connected to external pipes extending in the verticaldirection, joints to orthogonally change the direction of the flowpassage are necessary in many cases. In the mounting structure in FIG.6B, when the piping parts 801 and 805 extending in the verticaldirection (in other words, the inlet portion 1214 a and the outletportion 1214 b that open in the vertical direction) are connected toexternal pipes extending in the horizontal direction, joints toorthogonally change the direction of the flow passage are necessary inmany cases. The joint causes the fluid to generate the pressure loss.Thus, from the aspect of the reduction in the pressure loss of thecleaning liquid supply device, the joint is preferably omitted.

Meanwhile, in the mounting structure in FIG. 6C, the piping parts 801and 805 (the inlet portion 1214 a and the outlet portion 1214 b) haveopening directions inclined from the horizontal direction and thevertical direction. Thus, the opening directions are gently orientedwith respect to every pipe (piping part) extending in the horizontaldirection and the vertical direction. Accordingly, the external pipesextending in the horizontal direction and the vertical direction aregently curved to be connected to the piping parts 801 and 805 (the inletportion 1214 a and the outlet portion 1214 b). This allows the pipingparts 801 and 805 (the inlet portion 1214 a and the outlet portion 1214b) to be connected to the external pipes extending in the horizontaldirection and the vertical direction without using the joints. In theexample in FIG. 7 to FIG. 12, the external pipes extending in thehorizontal direction and the vertical direction are gently curved to beconnected to the piping part 801 (the inlet portion 1214 a) and anoutlet portion 1214 c of a valve block 1216. This allows the piping part801 (the inlet portion 1214 a) and the outlet portion 1214 c of thevalve block 1216 to be connected to the external pipes extending in thehorizontal direction and the vertical direction without using the joints(see FIG. 12).

FIG. 7 is a plan view of the CLC. FIG. 8 is a side view of the CLC. Inthis example, the valve block 1216 is mounted on the first chemicalliquid CLC 121. The first chemical liquid CLC 121 and the valve block1216 are mounted on a base 1215. The inlet portion 1214 a is disposed onthe chassis 1214. Here, the outlet portion 1214 b disposed on the pipingpart 805 in FIGS. 6A to 6C is integrally illustrated as a pipe betweenthe first chemical liquid CLC 121 and the valve block 1216. The firstchemical liquid CLC 121 may be connected to the valve block 1216 in anyconcatenation method. The inlet portion 1214 a is disposed on one endside of the piping part 801 and opens in a direction where the pipingpart 801 is extending. Here, the inlet portion 1214 a is exemplified asan end portion of the piping part 801, but a connector configured to beconnected to a pipe from outside may be mounted. The outlet portion 1214c having a configuration of a connector configured to be connected to apipe from outside is disposed on the valve block 1216. The inlet portion1214 a is connected to a primary side, that is, a side of the chemicalliquid supply source 20 and the DIW supply source 30. The outlet portion1214 c is connected to a secondary side, that is, a side of the cleaningdevice 200.

FIG. 9 is a plan view of a CLC assembly obtained by two CLCs arecombined. FIG. 10A is a side view from one side of the CLC assembly.FIG. 10B is a side view from another side of the CLC assembly. In thisexample, an example where the first chemical liquid CLC 121 and thefirst DIW CLC 122 are combined is illustrated, but the same applies to acase where the second chemical liquid CLC 131 and the second DIW CLC 132are combined. The first chemical liquid CLC 121 and the second chemicalliquid CLC 131 may be combined, and the first DIW CLC 122 and the secondDIW CLC 132 may be combined. In another embodiment, three or more CLCsmay be combined to be mounted on a common base. Two or more CLCs may bearranged in a common chassis. A plurality of CLC combinations arereferred to as the CLC assembly.

The first chemical liquid CLC 121 and the first DIW CLC 122 are securedto the common base 1215. In this example, the first chemical liquid CLC121 includes the valve block 1216, and the first DIW CLC 122 includes avalve block 1226. These valve blocks 1216 and 1226 are arrangedalongside and internally connected fluidically. That is, the fluidoutput from the first chemical liquid CLC 121 flows into the valve block1216, and the fluid output from the first DIW CLC 122 flows into thevalve block 1226. These fluids are mixed to be output from the outletportion 1214 c. The valve blocks 1216 and 1226 constitute the mixingportion 123 (see FIG. 2). The first chemical liquid CLC 121 and thefirst DIW CLC 122 may be connected to a single valve block.

FIG. 11 is a side view of the mounting structure of the CLC. FIG. 12 isa perspective view of the mounting structure of the CLC. In thisexample, a case where a plurality of CLCs are mounted via the commonbase 1215 is described, but each CLC may be mounted via an individualbase. As illustrated in these drawings, the CLC assembly (the firstchemical liquid CLC 121 and the second chemical liquid CLC) is mountedinclined from the horizontal direction and the vertical direction. TheCLC assembly is mounted with mounting bases 1218 and 1219 disposed in achassis 1217. The mounting base 1218 is secured to a bottom surface ofthe chassis 1217 and has one or a plurality of inclined surfaces thatsupport one end side of the base 1215 of the CLC assembly. The mountingbase 1219 is secured inside of a side surface of the chassis 1217 andhas an inclined surface that supports the other end side of the base1215 of the CLC assembly. The mounting base 1219 may be also configuredto have a plurality of inclined surfaces. The base 1215 of the CLCassembly is secured to the mounting base 1219 with a fastening membersuch as a bolt. The base 1215 of the CLC assembly may be also secured tothe mounting base 1218 with a fastening member. The inlet portion 1214 aof the first chemical liquid CLC 121 is connected to the pipe 81 (FIG.2). An inlet portion 1224 a of the first DIW CLC 122 is connected to thepipe 91. The outlet portion 1214 c is connected to the pipe 85 althoughnot illustrated. Here, the case where the pipe 81 is connected to theinlet portion 1214 a with the connector disposed on the pipe 81 isexemplified, but the connector may be disposed on a side of the chassis1214 of the first chemical liquid CLC 121, that is, on the inlet portion1214 a. The same applies to the pipe 91 and the first DIW CLC 122.

With this configuration, none of the piping parts of the pipe 800 in theCLC is arranged along the horizontal direction, thus ensuring thereduction in remaining of air (the air bubbles) in the pipe. The airbubbles tend to be likely to remain near the bent portion (the bentpart) of the pipe 800, but inclining the respective piping parts on bothsides of the bent portion from the horizontal direction and the verticaldirection ensures the reduction in the remaining of the air (the airbubbles) in the bent portion. The pipe 800 is inclined with respect tothe vertical direction, thus ensuring the reduction in the pressure lossin the pipe 800. Also when the pipe 800 is extending in a straight line,arranging the pipe 800 inclined can obtain similar operationaladvantages.

Second Embodiment

FIG. 13 is a flowchart of a flow rate control according to anotherexample. In the above-described embodiment, the flow rate is controlledby the flow rate control valve 1211 based on the detected value of theflowmeter 1212 (S15 and S21 in FIG. 4), but the flow rate may becontrolled based on the detected value by the pressure gauges 142 and153. In the flowchart in FIG. 4, when an abnormality is detected in theflowmeter 1212, the control is switched to the control based on thepressure gauges 142 and 153. This control flow is executed in parallelwith the control flow in FIG. 4, and at the point when the abnormalityis detected in the flowmeter, the control is switched to the controlbased on the pressure gauge.

In Step S110, it is determined whether the flowmeter is normal or not.This determination is performed, for example, whether the detected valueof the flowmeter 1212 indicates the flow rate set value (in an allowablerange) within a predetermined period or not, as a result of the flowrate control by the flowmeter 1212 and the flow rate control valve 1211with respect to the flow rate set value set in the control device 110.When the flowmeter is normal, transitioning to Step S120A, the controlof the flow rate (S15 and S21 in FIG. 4) is executed based on thedetected value of the flowmeter 1212 as described above. Meanwhile, whenthe flowmeter is not normal, transitioning to Step 120B, the control ofthe flow rate (S15 and S21 in FIG. 4) is executed based on the detectedvalue of the pressure gauges 142 and 153. In the control based on thedetected value of the pressure gauges 142 and 153, the control device110 sets a fluid pressure set value, and the feedback control isperformed on the flow rate control valve 1211 so that the detected valueof the pressure gauges 142 and 153 approaches the fluid pressure setvalue.

The flow rate control based on the pressure gauge may be mainlyperformed, and the control may be switched to the flow rate controlbased on the flowmeter when the abnormality is detected in the pressuregauge.

Third Embodiment

FIG. 14 is a flowchart of an abnormality detection control using thepressure gauge. This control flow is also executed in parallel with thecontrol flow in FIG. 4. In Step S210, a normal range as the detectedvalue of the pressure gauges 142 and 153 is set based on the flow rateset value or the fluid pressure set value set by the control device 110.For the normal range, for example, an experiment or the like ispreliminarily performed, and a table of the normal range correspondingto the flow rate set value or the fluid pressure set value has beenmade. It may be a fixed error range regardless of the flow rate setvalue and the fluid pressure set value. In Step S211, it is determinedwhether an actual detected value detected in the pressure gauges 142 and153 is in the set normal range or not. When the detected value of thepressure gauges 142 and 153 is in the normal range, the process fromStep S210 is repeated. Meanwhile, when the detected value of thepressure gauges 142 and 153 is out of the normal range, transitioning toStep S212, it is determined that the configuration on the secondary sideof the pressure gauges 142 and 153 is abnormal, thus executing a processin abnormality detection. The process in abnormality detection includesoutput of alarm to a user or another device, stop of the device, and thelike. The abnormality in the configuration on the secondary sideincludes a case where there is an abnormality such as leakage in thepipes 85, 95, and 96 and the like on the secondary side of the pressuregauges 142 and 153, a case where exact nozzles are not mounted as thenozzles 211 and 212, and the like. When a valve is mounted on the pipeon the secondary side of the pressure gauge, a case where the valve isabnormal can also detected as the abnormality on the secondary side.

With this embodiment, the abnormality in the pipe (for example, leakageof the pipe) on downstream of the flow rate control valve and theabnormality in the device (for example, the nozzle and the valve)connected to the pipe can be promptly detected based on the detectedvalue of the pressure gauge.

(Operational Advantage)

With the above-described embodiments, the chemical liquid are introducedfrom the identical chemical liquid supply source 20 to the firstchemical liquid dilution box 120 and the second chemical liquid dilutionbox 130 to allow the first chemical liquid dilution box 120 and thesecond chemical liquid dilution box 130 to each control the flow rateand the concentration of the chemical liquid. Accordingly, the flowrates and the concentrations of the chemical liquid (the chemical liquidafter dilution) supplied to the respective surfaces (the upper surfaceand the lower surface) of the substrate can be independently controlled.

The configuration where the first chemical liquid dilution box 120 andthe second chemical liquid dilution box 130 each output the chemicalliquid (the chemical liquid after dilution) can stop the output of thechemical liquid (the chemical liquid after dilution) from any of thefirst chemical liquid dilution box 120 and the second chemical liquiddilution box 130 by opening and closing the suck back valve unit 141,the open/close valve 151, and the open/close valve 152. The opening andclosing of the open/close valve 151 and the open/close valve 152 canstop any of the chemical liquid (the chemical liquid after dilution)supplied to the nozzle 212 of the cleaning device 200 and the waitingportion 230 in the cleaning portion 210. Accordingly, the control in thecleaning liquid supply device 100 can supply only any of the respectivesurfaces (the upper surface and the lower surface) of the substrate andthe waiting portion with the chemical liquid (the chemical liquid afterdilution). Therefore, it is not necessary to install an additional valveand the like in the cleaning device 200 to supply only any of therespective surfaces (the upper surface and the lower surface) of thesubstrate and the waiting portion with the chemical liquid (the chemicalliquid after dilution).

The first chemical liquid dilution box 120 and the second chemicalliquid dilution box 130 can control the respective flow rates of thechemical liquid (the chemical liquid after dilution). Thus, it is notnecessary to adjust the flow rate using the throttle as in the casewhere the chemical liquid (the chemical liquid after dilution) arebranched from a common flow passage. Therefore, the pressure loss of thechemical liquid and the dilution water receiving in the flow passages ofthe cleaning liquid supply device 100 and the cleaning device 200 isreduced to ensure suppression or prevention of the reduction in the flowrate of the chemical liquid (the chemical liquid after dilution) to thecleaning device 200. For example, even when supply pressures of thechemical liquid and/or the dilution water to the cleaning liquid supplydevice 100 are low, the reduction in the flow rate of the chemicalliquid (the chemical liquid after dilution) supplied to the respectivesurfaces (the upper surface and the lower surface) of the substrate canbe suppressed or prevented.

With the above-described embodiments, the use of the CLCs 121, 122, 131,and 132 including the flowmeter 1212 and the flow rate control valve1211 ensures simple and precise control of the flow rates of thechemical liquid and/or the dilution water by the signal from the controldevice 110. For example, compared with the case where the flow rates ofthe chemical liquid to the respective surfaces (the upper surface andthe lower surface) of the substrate are controlled by the throttle, thepressure loss in the flowmeter 1212 and the flow rate control valve 1211can be reduced. Compared with the case where the degree of opening ofthe throttle (for example, the needle valve) is manually adjusted, theCLCs 121, 122, 131, and 132 including the flowmeter 1212 and the flowrate control valve 1211 have an advantage in that the flow rate can beautomatically controlled.

With the above-described embodiments, the use of the ultrasonicflowmeter can reduce the pressure loss in the flowmeter compared withthe case where the differential pressure flowmeter (the orificeflowmeter) is used. In this configuration, the pressure loss in the flowpassage can be reduced to suppress the reduction in the flow rate thatcan be supplied to the substrate, thus having an advantage especiallywhen the supply pressures of the chemical liquid and/or the dilutionwater to the cleaning liquid supply device 100 are low.

With the above-described embodiments, changing the degree of opening ofthe valve body 1211 a with the driving source 1211 b including the motorensures quick and precise adjustment of the degree of opening of theflow rate control valve.

With the above-described embodiments, the suck back valve unit 141 candistribute/stop the output of the chemical liquid after dilution fromthe first chemical liquid dilution box 120. The suck back valve unit 141can reduce or prevent the dripping from the nozzle 211 when the outputfrom the first chemical liquid dilution box 120 is cut off.

With the above-described embodiments, supplying the substrate on thewaiting portion 230 that waits the cleaning with the chemical liquid(the chemical liquid after dilution) from the second chemical liquiddilution box 130, which supplies any surface (for example, the lowersurface) of the respective surfaces of the substrate with the chemicalliquid (the chemical liquid after dilution), can omit an additionalconfiguration for supplying the waiting substrate with the chemicalliquid (the chemical liquid after dilution), thus ensuring a simplifiedconfiguration of the fluid circuit.

From the description of the above-described embodiments, at least thefollowing technical ideas can be obtained.

According to a first aspect, a cleaning liquid supply device forsupplying a cleaning device with chemical liquid for cleaning isprovided. This cleaning liquid supply device includes a chemical liquidinlet portion and a dilution water inlet portion, a first chemicalliquid control unit fluidically connected to the chemical liquid inletportion and the dilution water inlet portion, and a second chemicalliquid control unit fluidically connected to the chemical liquid inletportion and the dilution water inlet portion. The first chemical liquidcontrol unit includes a first chemical-liquid-flow-rate control unitconfigured to receive a supply of chemical liquid from the chemicalliquid inlet portion to control a flow rate of the chemical liquid, afirst dilution-water-flow-rate control unit configured to receive asupply of a dilution water from the dilution water inlet portion tocontrol a flow rate of the dilution water, and a first mixing portionthat mixes the chemical liquid and the dilution water from the firstchemical-liquid-flow-rate control unit and the firstdilution-water-flow-rate control unit. The second chemical liquidcontrol unit includes a second chemical-liquid-flow-rate control unitconfigured to receive a supply of the chemical liquid from the chemicalliquid inlet portion to control a flow rate of the chemical liquid, asecond dilution-water-flow-rate control unit configured to receive asupply of the dilution water from the dilution water inlet portion tocontrol a flow rate of the dilution water, and a second mixing portionconfigured to mix the chemical liquid and the dilution water from thesecond chemical-liquid-flow-rate control unit and the seconddilution-water-flow-rate control unit.

With this aspect, the chemical liquid from an identical chemical liquidsupply source are diluted independently in the first and second chemicalliquid control units to ensure independent control of the flow rates andthe concentrations of the chemical liquid. For example, the flow ratesand the concentrations of the chemical liquid supplied to the respectivesurfaces of the substrate can be independently controlled.

The configuration where the chemical liquid are output from therespective first and second chemical liquid control units can stop theoutput of the chemical liquid from any of the first and second chemicalliquid control units by disposing a valve in the first and secondchemical liquid control units or related to the first and secondchemical liquid control units. Accordingly, the control in the cleaningliquid supply device ensures the supply of the chemical liquid to onlyany one of the upper surface or the lower surface of the substrate.Therefore, it is not necessary to install an additional valve and thelike in the cleaning device to supply only any one of the first surfaceand the second surface of the substrate with the chemical liquid.

The first and second chemical liquid control units can control therespective flow rates of the chemical liquid. Thus, it is not necessaryto adjust the flow rate using the throttle as in the case where thechemical liquid are branched from the common flow passage to therespective surface sides of the substrate. Therefore, the pressure lossof the chemical liquid and the dilution water receiving in the flowpassages of the cleaning liquid supply device and the cleaning device isreduced to ensure the suppression or the prevention of the reduction inthe flow rate of the chemical liquid to the cleaning device. Forexample, even when the supply pressures (input pressures) of thechemical liquid and/or the dilution water to the cleaning liquid supplydevice are low, the reduction in the flow rates of the chemical liquidsupplied to the respective surfaces of the substrate can be suppressedor prevented.

According to a second aspect, in the cleaning liquid supply device ofthe first aspect, the first and second chemical-liquid-flow-rate controlunits and the first and second dilution-water-flow-rate control unitseach include a flowmeter configured to detect the flow rate of thechemical liquid or the dilution water and a flow rate control valveconfigured to perform a feedback control on the flow rate of thechemical liquid or the dilution water based on a detected value of theflowmeter.

With this aspect, the use of the flow rate control unit including theflowmeter and the flow rate control valve ensures the simple and precisecontrol of the flow rates of the chemical liquid and/or the dilutionwater by the signal from the control unit such as a computer. Forexample, compared with the case where the flow rates of the chemicalliquid to the respective surface sides of the substrate are controlledby the throttle, the pressure loss in the flow passage can be reduced.Compared with the case where the degree of opening of the throttle ismanually adjusted, the flow rate control unit including the flowmeterand the flow rate control valve has an advantage in that the flow ratecan be automatically controlled.

According to a third aspect, in the cleaning liquid supply device of thesecond aspect, at least one of the first and secondchemical-liquid-flow-rate control units and the first and seconddilution-water-flow-rate control units includes an ultrasonic flowmeteras the flowmeter.

With this aspect, the use of the ultrasonic flowmeter can reduce thepressure loss in the flowmeter compared with the case where thedifferential pressure flowmeter (the orifice flowmeter) is used. In thisconfiguration, the pressure loss in the flow passage can be reduced tosuppress the reduction in the flow rate that can be supplied to thesubstrate, thus having an advantage especially when the supply pressuresof the chemical liquid and/or the dilution water to the cleaning liquidsupply device are low.

According to a fourth aspect, in the cleaning liquid supply device ofthe second or third aspect, in at least one of the first and secondchemical-liquid-flow-rate control units and the first and seconddilution-water-flow-rate control units, the flow rate control valve is amotor valve whose degree of opening is changed by a motor.

With this aspect, changing the degree of opening of the flow ratecontrol valve with the motor ensures the quick and precise adjustment ofthe degree of opening of the flow rate control valve.

According to a fifth aspect, in the cleaning liquid supply device of anyof the first to fourth aspects, the first chemical liquid control unitfurther includes a suck back valve unit on a downstream side of thefirst mixing portion.

With this aspect, the suck back valve unit can distribute/stop theoutput of the chemical liquid after dilution from the first chemicalliquid control unit. The suck back valve unit can reduce or prevent thedripping from the nozzle when the output from the first chemical liquidcontrol unit is cut off.

According to a sixth aspect, a cleaning unit is provided. This cleaningunit includes the cleaning liquid supply device of any of the first tofifth aspects, and the cleaning device connected to the cleaning liquidsupply device. The first and second chemical liquid control units areconfigured to supply each of a first surface and a second surface of anidentical substrate installed in the cleaning device with the chemicalliquid after dilution.

With this aspect, the chemical liquid from the identical chemical liquidsupply source are introduced to the first and second chemical liquidcontrol units, and respective chemical liquid having the flow rates andthe concentrations controlled independently in the first and secondchemical liquid control units are supplied to the first surface and thesecond surface of the substrate, thus ensuring the independent controlof the flow rates and the concentrations of the chemical liquid suppliedto the first surface and the second surface of the substrate.

The configuration where the chemical liquid are output from therespective first and second chemical liquid control units can stop theoutput of the chemical liquid from any of the first and second chemicalliquid control units by disposing the valve in the first and secondchemical liquid control units or related to the first and secondchemical liquid control units. Accordingly, the control in the cleaningliquid supply device ensures the supply of the chemical liquid to onlyany one of the first surface and the second surface of the substrate.Therefore, it is not necessary to install an additional valve and thelike in the cleaning device to supply only any one of the first surfaceand the second surface of the substrate with the chemical liquid.

The first and second chemical liquid control units can control therespective flow rates of the chemical liquid. Thus, it is not necessaryto adjust the flow rate using the throttle as in the case where thechemical liquid are branched from the common flow passage to sides ofthe first surface and the second surface of the substrate. Therefore,the pressure loss of the chemical liquid and the dilution waterreceiving in the flow passages of the cleaning liquid supply device andthe cleaning device is reduced to ensure the suppression or theprevention of the reduction in the flow rate of the chemical liquid tothe cleaning device. For example, even when the supply pressures of thechemical liquid and/or the dilution water to the cleaning liquid supplydevice are low, the reduction in the flow rates of the chemical liquidsupplied to the first surface and the second surface of the substratecan be suppressed or prevented.

According to a seventh aspect, in the cleaning unit of the sixth aspect,the second chemical liquid control unit is further configured to supplya substrate waiting or ready for cleaning in the cleaning device withthe chemical liquid after dilution.

Supplying the substrate that waits the cleaning with the chemical liquidfrom the second chemical liquid control unit, which supplies the lowersurface of the substrate with the chemical liquid, can omit anadditional configuration for supplying the waiting substrate with thechemical liquid, thus ensuring the simplified configuration of the fluidcircuit.

According to an eighth aspect, a storage medium that stores a program tocause a computer to execute a method for controlling a cleaning unit isprovided. The program causes the computer to execute receiving a supplyof chemical liquid from a chemical liquid inlet portion to control flowrates of the chemical liquid independently by first and secondchemical-liquid-flow-rate control units, receiving a supply of adilution water from a dilution water inlet portion to control flow ratesof the dilution water independently by first and seconddilution-water-flow-rate control units, mixing the chemical liquid andthe dilution water having the flow rates controlled by the firstchemical-liquid-flow-rate control unit and the firstdilution-water-flow-rate control unit in a first mixing portion tooutput the chemical liquid after dilution to the cleaning device, andmixing the chemical liquid and the dilution water having the flow ratescontrolled by the second chemical-liquid-flow-rate control unit and thesecond dilution-water-flow-rate control unit in a second mixing portionto output the chemical liquid after dilution to the cleaning device.

With this aspect, the chemical liquid from the identical chemical liquidsupply source are diluted independently in the first and second chemicalliquid control units to ensure the independent control of the flow ratesand the concentrations of the chemical liquid.

The configuration where the chemical liquid (the chemical liquid afterdilution) are output from the respective first and second chemicalliquid control units can stop the output of the chemical liquid from anyof the first and second chemical liquid control units.

The first and second chemical liquid control units can control therespective flow rates of the chemical liquid. Thus, it is not necessaryto adjust the flow rate using the throttle as in the case where thechemical liquid are branched from the common flow passage. Therefore,the pressure loss of the chemical liquid and the dilution waterreceiving in the flow passages of the cleaning liquid supply device andthe cleaning device is reduced to ensure the suppression or theprevention of the reduction in the flow rate of the chemical liquid tothe cleaning device.

According to a ninth aspect, in the storage medium of the eighth aspect,the program further causing the computer to execute supplying a firstsurface and a second surface of an identical substrate with the chemicalliquid after dilution from the first and second mixing portions isstored. The flow rates and the concentrations of the chemical liquidsupplied to the first surface and the second surface of the substratecan be independently controlled. The control in the cleaning liquidsupply device ensures the supply of the chemical liquid to only any oneof the first surface or the second surface of the substrate. Therefore,it is not necessary to install an additional valve and the like in thecleaning device to supply only any one of the first surface or thesecond surface of the substrate with the chemical liquid. Even when thesupply pressures of the chemical liquid and/or the dilution water to thecleaning liquid supply device are low, the reduction in the flow rate ofthe chemical liquid supplied to the first surface or the second surfaceof the substrate can be suppressed or prevented.

According to a tenth aspect, a cleaning liquid supply device forsupplying a cleaning device with chemical liquid for cleaning isprovided. This cleaning liquid supply device includes a flowmeter, afirst pipe that enters into the flowmeter, and a second pipe that exitsfrom the flowmeter. The first pipe and the second pipe are inclined froma horizontal direction and a vertical direction.

With this configuration, neither the first pipe nor the second pipe isarranged along the horizontal direction, thus ensuring the reduction inthe remaining of the air (the air bubbles) in the pipe. Both of thefirst pipe and the second pipe are inclined from the vertical direction,thus ensuring the reduction in the pressure loss of the flow passage.

According to an eleventh aspect, in the cleaning liquid supply device ofthe tenth aspect, the first pipe and the second pipe are arrangedinclined with an identical gradient.

With this aspect, the installation of the first and second pipes issimple.

According to a twelfth aspect, in the cleaning liquid supply device ofthe tenth or eleventh aspect, the flowmeter is arranged inclined.

With this aspect, the flow passage in the flowmeter and the flow passageformed of the first and second pipes can be inclined.

According to a thirteenth aspect, in the cleaning liquid supply deviceof any of the tenth to twelfth aspects, at least one of the first pipeand the second pipe is connected to a pipe extending in the horizontaldirection, and the pipe extending in the horizontal direction is curvedto approach a direction that at least one of the first pipe and thesecond pipe extends on a side connected to at least one of the firstpipe and the second pipe.

In this configuration, the pipe extending in the horizontal directioncan be curved to be connected to the first pipe and/or the second pipeextending with being inclined. When the pipe extending in the horizontaldirection is connected to the pipe extending in the vertical direction,the connection is performed via a joint in many cases since itsdirectional change is large. With the configuration of this aspect, thefirst pipe and the second pipe are arranged inclined. Thus, gentlycurving the pipe extending in the horizontal direction ensures theconnection to the first pipe and/or the second pipe. The first pipeand/or the second pipe may be connected to the pipe extending in thehorizontal direction via a valve.

According to a fourteenth aspect, in the cleaning liquid supply deviceof any of the tenth to twelfth aspects, at least one of the first pipeand the second pipe is connected to a pipe extending in the verticaldirection, and the pipe extending in the vertical direction is curved toapproach a direction that at least one of the first pipe and the secondpipe extends on a side connected to at least one of the first pipe andthe second pipe.

In this configuration, the pipe extending in the vertical direction canbe curved to be connected to the first pipe and/or the second pipeextending with being inclined. When the pipe extending in the verticaldirection is connected to the pipe extending in the horizontaldirection, the connection is performed via a joint in many cases sinceits directional change is large. With the configuration of this aspect,the first pipe and the second pipe are arranged inclined. Thus, gentlycurving the pipe extending in the vertical direction ensures theconnection to the first pipe and/or the second pipe. The first pipeand/or the second pipe may be connected to the pipe extending in thevertical direction via a valve.

According to a fifteenth aspect, in the cleaning liquid supply device ofany of the tenth to fourteenth aspects, at least one of the first pipeand the second pipe has a bent portion on an opposite side of theflowmeter, and respective piping parts on both sides of the bent portionare inclined from the horizontal direction and the vertical direction.

With this aspect, even when the first and/or second pipe has the bentportion, the respective piping parts on both sides of the bent portionare inclined, thus ensuring the reduction in the remaining of the air(the air bubbles) in the pipe. In the bent portion, the direction of thepipe is changed to have a tendency that the air is likely to remain, butinclining the respective piping parts on both sides of the bent portionfrom the horizontal direction and the vertical direction ensures thereduction in the remaining of the air (the air bubbles) in the bentportion.

According to a sixteenth aspect, in the cleaning liquid supply device ofany of the tenth to fifteenth aspects, the flowmeter is an ultrasonicflowmeter.

As described above, arranging the first and second pipes inclinedensures the reduction in the remaining of the air bubbles in these pipesand at the boundary, thus improving the detection accuracy of the flowrate with the ultrasonic flowmeter.

It is thought that the reduction in the remaining of the air bubbles inthe pipe also has an effect to reduce the drift (the bias of the flowrate) of the fluid flowing through the pipe. Thus, it is thought that,also when the differential pressure flowmeter is used, the detectionaccuracy of the flow rate can be improved.

According to a seventeenth aspect, in the cleaning liquid supply deviceof any of the tenth to sixteenth aspects, at least one of the first pipeand the second pipe is inclined from the vertical direction with aninclination angle of 10 degrees or more and 40 degrees or less.

Setting the angle of the inclination from the vertical direction to 10degrees or more and 40 degrees or less ensures the reduction in theremaining of the air bubbles and the reduction in the pressure loss ofthe fluid in the pipe at the same time. When the angle of theinclination is less than 10 degrees, the pressure loss in the pipe islarge. Meanwhile, when the angle of the inclination is more than 40degrees, the effect of the reduction in the remaining of the air bubblesis small. Even if it is out of this angle range, although the effect ofthe reduction in the pressure loss or the effect of the reduction in theremaining of the air bubbles is small, a certain effect can be obtainedby inclining the first pipe and the second pipe from the horizontal andvertical directions.

According to an eighteenth aspect, in the cleaning liquid supply deviceof any of the tenth to seventeenth aspects, a flow rate control valveand a pressure gauge arranged on a flow passage on an output side of theflow rate control valve are further included. In this aspect, the use ofthe detected value of the pressure gauge can perform the flow ratecontrol, the abnormality detection, and the like of the cleaning liquidsupply device.

According to a nineteenth aspect, in the cleaning liquid supply devicedescribed in the eighteenth aspect, the flow rate control valve isconfigured to control a flow rate based on a detected value of theflowmeter and is configured to control a flow rate based on a detectedvalue of the pressure gauge.

For example, when the flow rate control valve is controlled based on thedetected value of the flowmeter and the abnormality is detected in theflowmeter, the flow rate control valve can be controlled based on thedetected value of the pressure gauge. Its contrary using method is alsopossible. For example, the pressure gauge can be used as a backup of theflowmeter.

According to a twentieth aspect, in the cleaning liquid supply devicedescribed in the eighteenth or nineteenth aspect, an abnormalitydetection of at least one of a pipe on the output side of the flow ratecontrol valve and a device connected to the pipe is performed based on adetected value of the pressure gauge.

The abnormality in the pipe (for example, the leakage of the pipe) ondownstream of the flow rate control valve and the abnormality in thedevice (for example, the nozzle and the valve) connected to the pipe canbe detected based on the detected value of the pressure gauge.

According to a twenty-first aspect, a cleaning unit includes thecleaning liquid supply device of any of the tenth to twentieth aspectsand the cleaning device connected to the cleaning liquid supply device.

With this aspect, in the cleaning unit, the operational advantage of theabove-described aspects can be provided. This results in an accuratecontrol of the flow rate of the chemical liquid supplied to the cleaningdevice. In one example, even when the abnormality occurs in one of theflowmeter and the pressure gauge, the flow rate control with the flowrate control valve can be continued using the other sensor. Also, in oneexample, use of a pressure sensor can perform the abnormality detectionof the pipe, the nozzle, the valve, and the like.

The embodiments of the present invention have been described above basedon some examples in order to facilitate understanding of the presentinvention without limiting the present invention. The present inventioncan be changed or improved without departing from the gist thereof, andof course, the equivalents of the present invention are included in thepresent invention. It is possible to arbitrarily combine or omitrespective components according to claims and description in a range inwhich at least a part of the above-described problems can be solved, ora range in which at least a part of the effects can be exhibited.

The present application claims priority from Japanese Patent ApplicationNo. 2016-244469 filed on Dec. 16, 2016 and Japanese Patent ApplicationNo. 2017-236998 filed on Dec. 11, 2017. The entire disclosure includingthe descriptions, the claims, the drawings, and the abstracts inJapanese Patent Application No. 2016-244469 filed on Dec. 16, 2016 andJapanese Patent Application No. 2017-236998 filed on Dec. 11, 2017 isherein incorporated by reference.

The entire disclosure including the descriptions, the claims, thedrawings, and the abstracts in Japanese Unexamined Patent ApplicationPublication No. 9-260332 (Patent Literature 1), Japanese UnexaminedPatent Application Publication No. 2014-132641 (Patent Literature 2),Japanese Unexamined Patent Application Publication No. 2016-9818 (PatentLiterature 3), and Japanese Unexamined Patent Application PublicationNo. 2016-15469 (Patent Literature 4) is herein incorporated byreference.

REFERENCE SIGNS LIST

-   -   1 polishing device    -   2 housing    -   3 load port    -   4 a to 4 d polishing unit    -   5 a, 5 b cleaning unit    -   6 drying unit    -   7 first transport robot    -   8 transport unit    -   9 a second transport robot    -   9 b third transport robot    -   10 cleaning unit    -   20 chemical liquid supply source    -   30 DIW supply source    -   50 chemical liquid utility box    -   51 input portion    -   52 open/close valve    -   53 lockout valve    -   54 pressure gauge    -   60 regulator    -   61 input portion    -   80 to 86, 90 to 96 pipe    -   100 cleaning liquid supply device    -   101 case    -   120 first chemical liquid dilution box    -   121 first chemical liquid CLC    -   122 first DIW CLC    -   130 second chemical liquid dilution box    -   131 second chemical liquid CLC    -   132 second DIW CLC    -   141 suck back valve unit    -   142 pressure gauge    -   200 cleaning device    -   210 cleaning portion    -   211 nozzle    -   212 nozzle    -   230 waiting portion    -   300 control device    -   1211 flow rate control valve    -   1211 a valve body    -   1211 b driving source    -   1212 flowmeter    -   1213 control unit

What is claimed:
 1. A storage medium that stores a program to cause acomputer to execute a method for controlling a unit, the program causingthe computer to execute: receiving a supply of chemical liquid from anidentical chemical liquid inlet portion to control flow rates of thechemical liquid independently by first and secondchemical-liquid-flow-rate control units; receiving a supply of adilution water from an identical dilution water inlet portion to controlflow rates of the dilution water independently by first and seconddilution-water-flow-rate control units; mixing the chemical liquid andthe dilution water having the flow rates controlled by the firstchemical-liquid-flow-rate control unit and the firstdilution-water-flow-rate control unit in a first mixing portion tooutput the chemical liquid after dilution only to the upper surface of asubstrate installed in a cleaning device; and mixing the chemical liquidand the dilution water having the flow rates controlled by the secondchemical-liquid-flow-rate control unit and the seconddilution-water-flow-rate control unit in a second mixing portion tooutput the chemical liquid after dilution only to the lower surface ofthe identical substrate installed in the cleaning device.
 2. The storagemedium according to claim 1, wherein the unit comprises: the cleaningdevice; and a first device connected to the cleaning device forsupplying the cleaning device with the chemical liquid after dilutionfor cleaning the substrate, the first device comprising the chemicalliquid inlet portion, the dilution water inlet portion, the first andsecond chemical-liquid-flow-rate control units, the first and seconddilution-water-flow-rate control units, and the first and second mixingportions, wherein the first mixing portion is configured to only supplythe upper surface of the identical substrate installed in the cleaningdevice with the chemical liquid after dilution, and the second mixingportion is configured to only supply the lower surface of the identicalsubstrate with the chemical liquid after dilution.
 3. The storage mediumaccording to claim 1, wherein the first and secondchemical-liquid-flow-rate control units and the first and seconddilution-water-flow-rate control units each include: a flowmeterconfigured to detect the flow rate of the chemical liquid or thedilution water; and a flow rate control valve configured to perform afeedback control on the flow rate of the chemical liquid or the dilutionwater, wherein the program causes the computer to execute controllingthe flow rate control valve to perform a feedback control on the flowrate of the chemical liquid or the dilution water based on detectedvalues of the flowmeter.
 4. The storage medium according to claim 3,wherein at least one of the first and second chemical-liquid-flow-ratecontrol units and the first and second dilution-water-flow-rate controlunits includes an ultrasonic flowmeter as the flowmeter.
 5. The storagemedium according to claim 3, wherein in at least one of the first andsecond chemical-liquid-flow-rate control units and the first and seconddilution-water-flow-rate control units, the flow rate control valve is amotor valve whose degree of opening is changed by a motor.
 6. A devicefor supplying a cleaning device with chemical liquid for cleaning, thedevice comprising: a flowmeter; a first pipe that enters into theflowmeter; and a second pipe that exits from the flowmeter, wherein thefirst pipe and the second pipe are inclined from a horizontal directionand a vertical direction.
 7. The device according to claim 6, whereinthe first pipe and the second pipe are arranged inclined with anidentical gradient.
 8. The device according to claim 6, wherein theflowmeter is arranged inclined.
 9. The device according to claim 6,wherein at least one of the first pipe and the second pipe is connectedto a pipe extending in the horizontal direction, and the pipe extendingin the horizontal direction is curved to approach a direction that atleast one of the first pipe and the second pipe extends on a sideconnected to at least one of the first pipe and the second pipe.
 10. Thedevice according to claim 6, wherein at least one of the first pipe andthe second pipe is connected to a pipe extending in the verticaldirection, and the pipe extending in the vertical direction is curved toapproach a direction that at least one of the first pipe and the secondpipe extends on a side connected to at least one of the first pipe andthe second pipe.
 11. The device according to claim 6, wherein at leastone of the first pipe and the second pipe has a bent portion on anopposite side of the flowmeter, and respective piping parts on bothsides of the bent portion are inclined from the horizontal direction andthe vertical direction.
 12. The device according to claim 6, wherein theflowmeter is an ultrasonic flowmeter.
 13. The device according to claim6, wherein at least one of the first pipe and the second pipe isinclined from the vertical direction with an inclination angle of 10degrees or more and 40 degrees or less.
 14. The device according toclaim 6 further comprising: a flow rate control valve; and a pressuregauge arranged on a flow passage on an output side of the flow ratecontrol valve.
 15. The device according to claim 14, wherein the flowrate control valve is configured to control a flow rate based on adetected value of the flowmeter and is configured to control a flow ratebased on a detected value of the pressure gauge.
 16. The deviceaccording to claim 14, wherein an abnormality detection of at least oneof a pipe on the output side of the flow rate control valve and a deviceconnected to the pipe is performed based on a detected value of thepressure gauge.
 17. A cleaning unit comprising: the device according toclaim 6; and the cleaning device connected to the device according toclaim 6.